The automatic bonding machine is mainly used for automatic bonding of infrared device chips such as cadmium zinc telluride and indium sulfide in the semiconductor industry. Replace imported equipment and achieve localization of key equipment.

Equipment features: The system adopts industrial computer control, motion displacement positioning auxiliary grating ruler closed-loop control, and the table body adopts marble body, which solves the influence of processing plastic deformation and temperature environment on the accuracy of the machine. The overall accuracy of the equipment is high. The device can achieve automatic pasting of substrates and accompanying edges, and has functions such as active sheet feeding, automatic placement of accompanying edges, automatic glue coating, automatic glue uniformity, and heating of the wafer receiving table.